Advanced Thermal Interface Materials for Thermal Management
Wei Yu, Changqing Liu, Lin Qiu, Ping Zhang, Weigang Ma, Yanan Yue, Huaqing Xie and LeighAnn Sarah Larkin
Wei Yu1,Email
Changqing Liu2
Lin Qiu3
Ping Zhang4
Weigang Ma5
Yanan Yue6
Huaqing Xie1
LeighAnn Sarah Larkin7
1 College of Engineering, Shanghai Polytechnic University, Shanghai, 201209, China
2 School of Mechanical and Energy Engineering, Shaoyang University, Shaoyang, Hunan, 422001, China
3 School of Energy and Environmental Engineering, University of Science and Technology Beijing, Beijing, 100083, China
4 School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, 541004, China
5 Key Laboratory for Thermal Science and Power Engineering of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China
6 School of Power and Mechanical Engineering, Wuhan University, Wuhan, Hubei, 430072, China
7 Department of Mechanical and Aerospace Engineering, University of Virginia, 122 Engineer's Way, Charlottesville, VA, 22904-4746, USA
Abstract
Suitable temperature is a necessary condition for the normal operation of many devices, especially microelectronic devices. Therefore, heat dissipation has become a bottleneck in many fields. Furthermore, the largest thermal resistance in the process of heat transfer occurs between two solid surfaces due to the poor thermal conductivity of air that exists in the gaps. Replacing air with thermal interface materials (TIMs) is the fundamental way to solve the problem of heat dissipation. Consequently, TIMs are widely used in LED lighting, solar energy, microelectronics, electrical and electrical engineering, aerospace, defense and other fields.
Publication details
Received: 25 May 2018
Revised: 25 May 2018
Accepted: 27 May 2018
Published online: 28 May 2018
Article type:
Editorial
DOI:
10.30919/es8d710
Volume:
2
Page:
1-3
Citation:
Engineered Science, 2018, 2, 1-3
Permissions:
Copyright
Number of downloads:
6685
Citation Information:
8
Description:
Thermal interface materials with low thermal contact resistance occupy the development direction, an....
Thermal interface materials with low thermal contact resistance occupy the development direction, and among these, carbon materials, phase change materials and silver nanopaste demonstrate great potential applications
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